盛群无铅产品的「可靠度试验」结果

以下两种封装型式之纯锡(Matte Tin plating, i.e. Pure Sn plating)电镀成品均已通过可靠度试验,测试项目与结果如下:(SOT-25之试验结果依SOT-89报告,可适用)

测式项目
封装型式
Precondition TCT PCT Solderability
SOT-89 PASS PASS PASS PASS
TO-92 N/A PASS PASS PASS
SOP系列 PASS PASS PASS PASS
DIP系列 N/A PASS PASS PASS
QFP系列 PASS PASS PASS PASS
QFN系列 PASS PASS PASS PASS

可靠度的测试条件如下:

No. Test Item Sample Size Accept/Reject LTPD% Reference Test Condition
1 Precondition 55 1/2 7% A113-A
J-STD-020C
Level 3
TCT:-65℃~150℃, 5cyclesBaking: 125℃, 24hrsSoaking: 30℃/60%RH, 192hrsIR Reflow:260℃(-5, 0), 3cycles
2 Temperature Cycling Test(TCT: Air to Air) 55 1/2 7% MIL-STD-883E
1010.7
-65 ℃ ~ 150 ℃(10min 10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 55 1/2 7% JEDEC-A121 Ta=121℃,100%RH , 168Hrs,15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003
1. Steam Age 8hrs

2. 245℃+-5℃, 5sec

5 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25±5℃, 30~80%RH1000Hrs
  Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60±5℃, 90±5%%RH1000Hrs

J-STD-020-C标准回焊温度曲线如下:

SOT-89实际实验之回焊温度曲线如下

详细之可靠度之试验报告

JEDEC Standard Spec : J-STD-020-C