盛群Green封装产品的「可靠度试验」

以下四种封装型式之纯锡(Matte Tin plating, i.e. Pure Sn plating)电镀与无卤封装成品均已通过可靠度试验，测试项目与结果如下：

测式项目
封装型式
Precondition TCT PCT Solder ability
SOT-89 PASS PASS PASS PASS
SOP系列 PASS PASS PASS PASS
QFP系列 PASS PASS PASS PASS
QFN系列 PASS PASS PASS PASS

可靠度的测试条件如下：

No. Test Item Sample Size Accept/Reject LTPD% Reference Test Condition
1 Precondition 45 0/1 5% J-STD-020
Level 3  		TCT:-65°C~150°C, 5cycles
Baking: 125°C, 24hrs
Soaking:60°C/60%RH, 40hrs
IR Reflow: 260±2°C, 3cycles 
2 Temperature Cycling Test(TCT: Air to Air) 45 0/1 5% MIL-STD-883E
1010.7 		-65°C………………150°C
(10min  <5min   10min)
100 Cycles
3 Pressure Cook Test ( PCT ) 45 0/1 5% JEDEC-A121 Ta=121℃,100%RH , 168Hrs,15psig(2atm)
4 Solderability 10 0/1 - MIL-STD-883E
M2003 		1. Steam Age 8hrs

2. 245℃+-5℃, 5sec

5 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 25±5℃, 30~80%RH1000Hrs
　 Whisker(R.T.) 5 0/1 - HOLTEK SPEC 60±5℃, 90±5%%RH1000Hrs

J-STD-020-D标准回焊温度曲线如下：

6.实际实验之回焊温度曲线如下

详细之可靠度之试验报告

JEDEC Standard Spec : J-STD-020-D