Revision # 1.90   Modifications made on October 12, 2009

• In the Pad Assignment section, the chip size was modified.
  
• In the Pad Coordinates section was modified.

Revision # 1.80    Modifications made on July 29, 2009

• In the Features section, the package information was modified.
  
• In the Pad Assignment section, the Bump information was added.

Revision # 1.70    Modifications made on June 12, 2009

• In the A.C. Characteristics section, the t_OFF and t_SR entries and other related Note description & Figure were added.

Revision # 1.60   Modifications made on March 20, 2009

• In the Features section, the “Cascade application” item was removed.

Revision # 1.50   Modifications made on February 27, 2009

• The A.C. Characteristics table was modified.

Revision # 1.40   Modifications made on February 6, 2009

• The A.C. Characteristics table was modified.

Revision # 1.31   Modifications made on September 25, 2008

• A Patent Notice has been added to the datasheet.

Revision # 1.30   Modifications made on June 13, 2008

• In the Features, Pin Assignment and other related sections, the 64-pin QFP package type was modified to a 64-pin LQFP package type.

Revision # 1.20   Modifications made on May 19, 2004

• At the Absolute Maximum Ratings section, the Operating Temperature range was modified from -25^oC~75^oC to -40^oC~85^oC.

Revision # 1.10   Modifications made on September 11, 2001

• At the Pad Description table, the description for the falling edge and rising edge of the RD were interchanged.
• Package Information section was added.